{
  "uri": "alkn://truthloops/np1/np1-electronics-precision",
  "contents": [
    {
      "uri": "alkn://truthloops/np1/np1-electronics-precision",
      "mimeType": "application/json",
      "text": "{\n  \"source_role\": \"commissioned\",\n  \"observation_type\": \"observation\",\n  \"evidence_payload_retrievable\": true,\n  \"scope_temporal\": \"historical\",\n  \"scope_temporal_note\": \"2022-12-06 ASACERT snapshot unless the loop overrides.\",\n  \"loop_id\": \"np1-electronics-precision\",\n  \"polarity\": \"positive\",\n  \"proposition\": \"High-purity ultrafine nickel wire CAN BE SUITABLE for precision electronics, microelectronics, MEMS, sensors, flexible circuits and fine conductive elements when its exact condition meets the engineering specification.\",\n  \"bounded_meaning\": \"\\\"Can be suitable\\\" — application suitability is a specification-matched question for each customer's engineering process. General technical relevance of ultrafine high-purity nickel wire does not equal already-qualified inventory for a named component.\",\n  \"required_evidence\": [\n    \"Independent technical application sources (industry references for ultrafine nickel wire in precision electronics / MEMS / sensors / flexible circuits)\",\n    \"Product-form compatibility (diameter, conductivity, surface, mechanical properties versus device requirements)\",\n    \"Any customer or qualification evidence specific to this inventory\"\n  ],\n  \"positive_edges\": [\n    {\n      \"type\": \"supporting\",\n      \"source\": \"Independent electronics-industry technical literature\",\n      \"scope\": \"Ultrafine nickel wire is used in fine conductive elements, thermocouple leads, sensor windings, flexible-circuit interconnects and precision resistive/conductive components\"\n    },\n    {\n      \"type\": \"supporting\",\n      \"source\": \"Lectromec (ISO/IEC 17025:2017 accredited) wire specification testing\",\n      \"scope\": \"Applicable wire-specification testing standards for precision electronic applications\"\n    }\n  ],\n  \"negative_edges\": [\n    {\n      \"type\": \"counterevidence\",\n      \"source\": \"Application-generality-vs-qualification overreach\",\n      \"scope\": \"General suitability of the wire class is not proof that the stored inventory is already qualified for a named semiconductor, AI-chip, MEMS or medical component. Qualification requires customer specification and acceptance.\"\n    }\n  ],\n  \"unresolved_edges\": [\n    {\n      \"type\": \"unresolved\",\n      \"source\": \"Customer qualification for a named component\",\n      \"scope\": \"No customer or process-specific qualification of the stored inventory for any named electronic device has been ingested\"\n    }\n  ],\n  \"closure_condition\": \"Close only to the general suitability of the wire class. Named-component qualification remains a separate ray requiring customer-specific evidence.\",\n  \"do_not_publish\": [\n    \"\\\"Qualified for semiconductor fabrication\\\"\",\n    \"\\\"Qualified for AI-chip fabrication\\\"\",\n    \"\\\"Certified for [named-device] production\\\"\",\n    \"Any statement that treats general technical suitability as inventory-specific qualification\"\n  ],\n  \"linked_loops\": [\n    \"np1-ultrafine-geometry\",\n    \"np1-medical-sensor-mems\",\n    \"np1-ai-data-centre-relevance\",\n    \"disambiguation-grade-name-not-lot-proof\"\n  ],\n  \"linked_resources\": [\n    \"alkn://claims/valuation\",\n    \"alkn://evidence/manifest\"\n  ],\n  \"status\": \"OPEN\",\n  \"effective_date\": \"2026-09-17\"\n}"
    }
  ]
}